Work package projects:

• Novel silicon 3D-trench pixel detector fabricated on the 8-inch wafer utilizing CMOS processing technologies (CDS)
• LGAD based timing tracker development for future electron collider (CDS)
• Development of very small pitch, ultra rad- hard 3D sensors for tracking + timing applications at FBK (CDS)
• Development of Ultra-Fast-Time Low Mass Tracking Detectors (CDS)
• Development of TI-LGADs for 4D Tracking (CDS)